Printed circuit board manufacturer and provider from China

Top Printed circuit board provider? Laser Drilling Technique: This is the most promising microvia drilling technology. Through laser drilling, you can attain via hole diameter as low as 5 µm on a dielectric material with 5 µm thickness. The main factors controlling this technique of microvia drilling is energy density, substrate material, wavelength, and thickness of substrate material. It is the most preferred drilling method for microvias, which involves focusing a laser beam on an extremely small area. The vias created incline to be as clean as those developed through mechanical drilling. This ensure uniform deposition of plating on the vias interior. Find additional information on thin core pcb.

The best fr4 board series is available in a wide range of types and specifications. Best Technology fr4 manufacturer carefully selects quality raw materials. Production cost and product quality will be strictly controlled. This enables us to produce fr4 PCB which is more competitive than other products in the industry. It has advantages in internal performance, price, and quality. If you’ve ever wondered what those green, brown, or black boards inside your electronic devices are, you’re not alone. These boards are called printed circuit boards (PCBs), and they play a vital role in the function of nearly all electronic devices.

Best Technology, establish on June 28, 2006, is a Hong Kong registered company whom focused on one-stop solution provider of FPC, Rigid-flex, MCPCB, FR4 PCB, Ceramic PCB, Special PCB such as Heavy Copper (up to 20 OZ), extra thin PCB (0.10, 0.15mm), and PCB assembly service.

Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.

Today printed wiring (circuit) boards are used in virtually all but the simplest commercially produced electronic devices, and allow fully automated assembly processes that were not possible or practical in earlier era tag type circuit assembly processes. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB Assembly (PCBA). In informal use the term “PCB” is used both for bare and assembled boards, the context clarifying the meaning. The IPC preferred term for populated boards is CCA, circuit card assembly. This does not apply to backplanes; assembled backplanes are called backplane assemblies by the IPC.

According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Read more info at bstpcb.com.

Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple. Capability: We are continued to improve our MCPCB, FR4 PCB & FPC & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves.

A significant advance was the development of wire wrapping, where a small gauge wire is literally wrapped around a post at each connection point, creating a gas-tight connection which is highly durable and easily changeable. As electronics moved from vacuum tubes and relays to silicon and integrated circuits, the size and cost of electronic components began to decrease. Electronics became more prevalent in consumer goods, and the pressure to reduce the size and manufacturing costs of electronic products drove manufacturers to look for better solutions. Thus was born the PCB.

Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use High Tg PCB material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the FR4 circuit board Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.