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Nowadays, Wi-Fi devices are ubiquitous in our lives. Casually open the home wireless routing management interface, there may be no less than 10 Wi-Fi devices online at the same time. The increase in the number of devices leads to network congestion, performance degradation, increased delay and other problems. These problems became more serious in the era of Wi-Fi 5 (802.11 ac). Therefore, when designing Wi-Fi 6 (802.11 ax), experts made improvements and innovations specifically for the problem of network congestion. So, what new technologies does Wi-Fi 6 use to improve wireless channel capacity? When the user equipment receives the AP signal, it will compare whether the color it receives is consistent with the current associated AP color. When the color is the same, the user will think that the signal is the signal in the cell. If the color of the received signal is different from that of the associated AP, the user determines that the signal belongs to the interference signal. As shown in the following figure, due to the use of different color codes, the channel 1 of the green cell is no longer interfered by the adjacent cell channel 1 (blue and red).

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.

In the early CPUs, the chip integration level was very low. The CPU was a single chip. It only integrated an arithmetic unit and a controller. It could only calculate and control. At this time, the internal capacity of the CPU was useless. Memory, the CPU left The memory cannot be calculated. Back then, there was no memory in the CPU because the memory could not be integrated, and others such as the serial port could not be integrated, so there was only a single CPU. If you need to use the serial port, you need to use a serial port controller chip outside the CPU. The PCB traces are connected to the CPU, and then the entire PCB board is composed of the CPU, and these peripheral chips is called a system board. This system board can communicate with another system board. The CPU communicates with another system through its serial port controller. The serial port controller on the board communicates, and functions such as the serial port controller cannot be integrated into the CPU chip. For example, if the LCD is also used here, it is necessary to add an LCD controller chip to the periphery and connect it to the CPU through wiring. A whole board composed of these chips is called a system board. These UART controllers and LCD controllers are called peripherals. Combining them with the CPU on one board is the function implemented by a current K60 chip, but they are integrated into a small chip. The peripherals here refer to the inside of the system board, the peripherals outside the CPU are called peripherals, the CPU is called the internals, and there are only arithmetic units and controllers inside, which are called internals.

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